Oxford Solders: Solder BGA Spheres

Like solder powder spheres, BGA spheres are also made of solder alloys. The difference is that BGA spheres are larger than spheres in solder powders and, in a BGA sphere sample, all the spheres have the same diametre whereas in solder powder the spheres have a range of diametres. BGA spheres are used directly to join the silicon wafer integrated circuits ("IC"), also called Silicon Chips, to the circuit board or to join the Silicon Chips to their packages ("IC package"). Only BGA spheres can fulfil these functions.

Oxford Solders has proprietary technology not only to manufacture the regular 300 micron diametre BGA spheres but has also now won a prestigious UK government R&D grant to build specialist proprietary equipment to manufacture Ultra Fine BGA (UFBGA) spheres less than 200 microns diameter in size. In Q1/2009, the company will offer <200 microns BGA spheres together with placement technology from our Japanese partners.

Oxford Solders is offering BGA spheres in diameters from 600 microns down to 200 microns in a range of lead free and tin-lead alloys.