Oxford Solders: Solder Powder

PCBs have custom designed patterns of electrically conducting copper tracks to which are soldered electronic components. The current industry standard joining procedure involves soldering the components to copper tracks using solder paste which is made by mixing solder (a metallic alloy) powder (90% by weight) with an organic chemical cream called flux (10% by weight).

Over the years, the sizes of spheres present in solder powders have become smaller and smaller. Powders of very fine size spheres (Type 4-6) are now needed by the market due to electronics devices continuously decreasing in size whilst requiring greater and greater functionality. For example, mobile phones that now fulfil multiple functions such as telephony, photography, internet surfing and email. The small sizes and higher functionalities are achieved by packing more and more and smaller and smaller electronic components onto a circuit board. Overall, this has resulted in a continuous drive for smaller and smaller soldered joints.

Oxford Solders offers a range of regular and unique solder powder products in Type 3-6 particle sizes, tight particles size distributions, highly spherical with low oxide contents of less than 100 ppm.

Contact Oxford Solders for further information and prices.