News: >> 04/01/10 BizEsp

04/01/10 BizEsp proposal wins £3m FP7 BGA project

Project acronym: µBGA

Full title: A Novel System for the Production of World's First Micro Ball Grid Array (µBGA) Spheres for enabling the EU Electronics Industry to produce smaller electronics goods.

BizEsp's unique IPR and know-how in the area of BGA sphere manufacturing technology is the basis of this project aimed at manufacturing ultra-fine BGA spheres in sizes down to 75µm sphere diameter in high yield and quality with CpK values > 1.33. Identifying this opportunity for innovation, BizEsp commissioned the preparation of a project proposal which subsequently won EC 7th Framework Programme approval.

BGA solder balls are used in the manufacture of CPUs, RAMs, consumer electronics and displays. Ultra-fine BGA spheres enable higher I/O densities needed for the latest generation of CPUs, RAMs, smart cell phones and displays.


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  • 16/06/10 BizEsp China partner ITO factory enters pilot production
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  • 15/04/10 BizEsp proposal wins £2m FP7 solder powder project
  • 28/01/09 BizEsp completes first ITO production line
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