Investor Relations

BizEsp has to date invested £1.8 million of resources into developing its technologies and products. In 2009, BizEsp completed the design, built and testing of a new and unique indium tin oxide (ITO) sputtering target production line which has now been shipped to its client China Tin Group (CTG) under a confidential agreement and has been installed in a purpose built facility in Liuzhou, Guangxi Province, China. This line will be in full production mode by Q4/2010. BizEsp's ITO has already been successfully tested in the UK by an independent organisation. The Company's ITO technology is protected by strong IPR (patents pending globally), proprietary know-how and strategic partnerships with owners of indium resources.

In 2009, the Company initiated and has won funding from the European Union's Framework 7 programme totalling £6m for consortium members that include blue chip names such as Henkel. These projects are connected with the drive for ultra-miniaturisation/ultlra-functionality of electronics equipment. Achievement of these twin drivers can reduce raw material requirements, reduce electronics waste and deliver a competitive edge to the European electronics industry, moving it up the value chain to high value added and high margin products.

The Company is now in the closing stages of a fund raising for further expansion of its ITO and other operations.

The Company is also in negotiations with potential partners for the establishment of a joint venture in China to manufacture unique and novel products for the manufacture of printed circuit board assemblies.

The above products and technologies are used by the solar and electronics industries. These are both high volume and high growth industries projected to sustain high growth rates of 30-40% per annum for the foreseeable future.